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74LVC1G175GM,132 vs 74LVC1G79GW,165 feature comparison

74LVC1G175GM,132 NXP Semiconductors

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74LVC1G79GW,165 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON TSSOP
Package Description VSON, SOLCC6,.04,20 TSSOP, TSSOP5/6,.08
Pin Count 6 5
Manufacturer Package Code SOT886 SOT353-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-N6 R-PDSO-G5
JESD-609 Code e3 e3
Length 1.45 mm 2.05 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 175000000 Hz
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 6 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Equivalence Code SOLCC6,.04,20 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 7.5 ns 6.5 ns
Propagation Delay (tpd) 17 ns 12.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 2.7 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 1 mm 1.25 mm
fmax-Min 200 MHz 200 MHz
Base Number Matches 2 2
Logic » FF/Latches
Logic » FF/Latches

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