74LVC1G17GV vs SN74LVC1G17DBVT feature comparison

74LVC1G17GV Philips Semiconductors

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SN74LVC1G17DBVT Rochester Electronics LLC

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Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer PHILIPS SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP LSSOP
Package Equivalence Code TSOP5/6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Packing Method TR
Prop. Delay@Nom-Sup 7 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.95 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Pbfree Code Yes
Part Package Code SOT-23
Package Description LSSOP,
Pin Count 5
Family LVC/LCX/Z
Length 2.9 mm
Moisture Sensitivity Level 1
Number of Functions 1
Number of Inputs 1
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 11 ns
Seated Height-Max 1.45 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.6 mm