74LVC1G17GW vs SN74LVC1G17DCKRE4 feature comparison

74LVC1G17GW Philips Semiconductors

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SN74LVC1G17DCKRE4 Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer PHILIPS SEMICONDUCTORS TEXAS INSTRUMENTS INC
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A 0.024 A
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Prop. Delay@Nom-Sup 7 ns 5.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Pbfree Code Yes
Part Package Code SOIC
Package Description TSSOP, TSSOP5/6,.08
Pin Count 5
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Family LVC/LCX/Z
Length 2 mm
Moisture Sensitivity Level 1
Number of Functions 1
Number of Inputs 1
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.01 mA
Propagation Delay (tpd) 11 ns
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm

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