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74LVC1G32GW-Q100H vs 74LVC1G32GW,165 feature comparison

74LVC1G32GW-Q100H Nexperia

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74LVC1G32GW,165 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5 TSSOP, TSSOP5/6,.08
Pin Count 5 5
Manufacturer Package Code SOT353-1 SOT353-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2.05 mm 2.05 mm
Logic IC Type OR GATE OR GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR, 7 INCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Propagation Delay (tpd) 10.5 ns 10.5 ns
Screening Level AEC-Q100
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code TSSOP5/6,.08
Prop. Delay@Nom-Sup 6 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Logic » Gates
Logic » Gates

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