74LVC1G58GW,125 vs SN74LVC1G57DCKRE4 feature comparison

74LVC1G58GW,125 NXP Semiconductors

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SN74LVC1G57DCKRE4 Texas Instruments

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Source Content uid 74LVC1G58GW,125 SN74LVC1G57DCKRE4
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code TSSOP SOIC
Package Description PLASTIC, SOT-363, SC-88, 6 PIN TSSOP, TSSOP6,.08
Pin Count 6 6
Manufacturer Package Code SOT363
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e4
Length 2 mm 2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type LOGIC CIRCUIT LOGIC CIRCUIT
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 7.9 ns 6.3 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Pbfree Code Yes
Output Characteristics 3-STATE

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