Findchips: Compare 74LVC1G58GW vs 74LVC1G57GW,125

74LVC1G58GW vs 74LVC1G57GW,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	NEXPERIA	NXP SEMICONDUCTORS
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G6	R-PDSO-G6
JESD-609 Code	e3	e3
Length	2 mm	2 mm
Logic IC Type	LOGIC CIRCUIT	LOGIC CIRCUIT
Moisture Sensitivity Level	1	1
Number of Functions	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	260	260
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	TIN	Tin (Sn)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	1.25 mm	1.25 mm
Base Number Matches	3	2
Part Package Code		TSSOP
Package Description		PLASTIC, SOT-363, SC-88, 6 PIN
Pin Count		6
Manufacturer Package Code		SOT363
Load Capacitance (CL)		50 pF
Max I(ol)		0.024 A
Package Equivalence Code		TSSOP6,.08
Packing Method		TR
Prop. Delay@Nom-Sup		7.9 ns
Schmitt Trigger		YES
	Logic » Other Logic ICs	Logic » Other Logic ICs