74LVC1G79GW,118 vs 74LVC1G79GW-Q100H feature comparison

74LVC1G79GW,118 NXP Semiconductors

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74LVC1G79GW-Q100H Nexperia

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP-5
Pin Count 5 5
Manufacturer Package Code SOT353-1 SOT353-1
Reach Compliance Code unknown compliant
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2.05 mm 2.05 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 12.5 ns 12.5 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 1.25 mm 1.25 mm
fmax-Min 200 MHz 200 MHz
Base Number Matches 2 1
Rohs Code Yes
Samacsys Manufacturer Nexperia
Moisture Sensitivity Level 1
Packing Method TR, 7 INCH
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) 30

Compare 74LVC1G79GW,118 with alternatives

Compare 74LVC1G79GW-Q100H with alternatives