Findchips: Compare 74LVC1G80GW,115 vs 74LVC1G80GW-Q100,1

74LVC1G80GW,115 vs 74LVC1G80GW-Q100,1 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	TSSOP	TSSOP
Package Description	TSSOP,	1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5
Pin Count	5	5
Manufacturer Package Code	SOT353-1	SOT353-1
Reach Compliance Code	unknown	compliant
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e3	e3
Length	2.05 mm	2.05 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Number of Bits	1	1
Number of Functions	1	1
Number of Terminals	5	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Polarity	INVERTED	INVERTED
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	13 ns	13 ns
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	TIN	Tin (Sn)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	1.25 mm	1.25 mm
fmax-Min	200 MHz	200 MHz
Base Number Matches	2	2
Rohs Code		Yes
Load Capacitance (CL)		50 pF
Max I(ol)		0.024 A
Package Equivalence Code		TSSOP5/6,.08
Packing Method		TR
Qualification Status		Not Qualified
Screening Level		AEC-Q100
	Logic » FF/Latches	Logic » FF/Latches