Findchips: Compare 74LVC1G97GW vs 74LVC1G57GW,125

74LVC1G97GW vs 74LVC1G57GW,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Active
Ihs Manufacturer	NEXPERIA	NEXPERIA
Package Description	TSSOP,	PLASTIC, SOT-363, SC-88, 6 PIN
Reach Compliance Code	compliant	compliant
ECCN Code	EAR99
HTS Code	8542.39.00.01	8542.39.00.01
Samacsys Manufacturer	Nexperia	Nexperia
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G6	R-PDSO-G6
JESD-609 Code	e3	e3
Length	2 mm	2 mm
Logic IC Type	MAJORITY LOGIC GATE	LOGIC CIRCUIT
Moisture Sensitivity Level	1	1
Number of Functions	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	260	260
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	TIN	TIN
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	1.25 mm	1.25 mm
Base Number Matches	2	2
Part Package Code		TSSOP
Pin Count		6
Manufacturer Package Code		SOT363-2
Factory Lead Time		6 Weeks
Packing Method		TR, 7 INCH
	Logic » Other Logic ICs	Logic » Other Logic ICs