74LVC1G98GW vs SN74LVC1G57DCKRE4 feature comparison

74LVC1G98GW NXP Semiconductors

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SN74LVC1G57DCKRE4 Texas Instruments

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Source Content uid 74LVC1G98GW SN74LVC1G57DCKRE4
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SOT-363 SOIC
Package Description PLASTIC, SOT-363, SC-88, PACKAGE-6 TSSOP, TSSOP6,.08
Pin Count 6 6
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
Length 2 mm 2 mm
Logic IC Type LOGIC CIRCUIT LOGIC CIRCUIT
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 2.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish PURE TIN NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Pbfree Code Yes
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Output Characteristics 3-STATE
Package Equivalence Code TSSOP6,.08
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supplies 3.3 V
Prop. Delay@Nom-Sup 6.3 ns
Schmitt Trigger YES
Time@Peak Reflow Temperature-Max (s) 30

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Compare SN74LVC1G57DCKRE4 with alternatives