74LVC1G98GW
vs
74LVC1G58GW
feature comparison
| Source Content uid |
74LVC1G98GW
|
74LVC1G58GW
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
| Package Description |
TSSOP,
|
PLASTIC, SOT-363, SC-88, 6 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-609 Code |
e3
|
e3
|
| Logic IC Type |
MAJORITY LOGIC GATE
|
LOGIC CIRCUIT
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN
|
Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
3
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOT-363
|
| Pin Count |
|
6
|
| ECCN Code |
|
EAR99
|
| Family |
|
LVC/LCX/Z
|
| JESD-30 Code |
|
R-PDSO-G6
|
| Length |
|
2 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.024 A
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
6
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP6,.08
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
|
TAPE AND REEL
|
| Power Supplies |
|
3.3 V
|
| Prop. Delay@Nom-Sup |
|
7.9 ns
|
| Schmitt Trigger |
|
YES
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
1.25 mm
|
|
|
|
Compare 74LVC1G98GW with alternatives
Compare 74LVC1G58GW with alternatives