74LVC1G98GW vs 74LVC1G58GW,125 feature comparison

74LVC1G98GW NXP Semiconductors

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74LVC1G58GW,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOT-363 TSSOP
Package Description PLASTIC, SOT-363, SC-88, PACKAGE-6 PLASTIC, SOT-363, SC-88, 6 PIN
Pin Count 6 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
Length 2 mm 2 mm
Logic IC Type LOGIC CIRCUIT LOGIC CIRCUIT
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 2.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Pure Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Manufacturer Package Code SOT363
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code TSSOP6,.08
Packing Method TR
Prop. Delay@Nom-Sup 7.9 ns
Schmitt Trigger YES

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Compare 74LVC1G58GW,125 with alternatives