74LVC1G98GW vs NC7SZ57P6X feature comparison

74LVC1G98GW NXP Semiconductors

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NC7SZ57P6X Fairchild Semiconductor Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOT-363 SC-70
Package Description PLASTIC, SOT-363, SC-88, PACKAGE-6 SC-70, 6 PIN
Pin Count 6 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
Length 2 mm 2 mm
Logic IC Type LOGIC CIRCUIT MAJORITY LOGIC GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 2.3 V 2.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Pure Tin (Sn) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Pbfree Code Yes
Manufacturer Package Code 6LD,SC70,EIAJ SC-88,1.25MM WIDE
ECCN Code EAR99
Additional Feature IT ALSO HAS SC-88 PACKAGE
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.032 A
Number of Inputs 2
Package Equivalence Code TSSOP6,.08
Packing Method TR
Power Supply Current-Max (ICC) 50 mA
Prop. Delay@Nom-Sup 8.5 ns
Propagation Delay (tpd) 14.5 ns
Schmitt Trigger NO

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