74LVC1G98GW vs NLV7SZ97DFT2G feature comparison

74LVC1G98GW NXP Semiconductors

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NLV7SZ97DFT2G onsemi

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Source Content uid 74LVC1G98GW NLV7SZ97DFT2G
Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ON SEMICONDUCTOR
Part Package Code SOT-363
Package Description PLASTIC, SOT-363, SC-88, PACKAGE-6 TSSOP, TSSOP6,.08
Pin Count 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
Length 2 mm 2 mm
Logic IC Type LOGIC CIRCUIT LOGIC CIRCUIT
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 2.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish PURE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Pbfree Code Yes
Manufacturer Package Code 419B-02
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code TSSOP6,.08
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supplies 3.3 V
Prop. Delay@Nom-Sup 6.3 ns
Schmitt Trigger YES
Screening Level AEC-Q101
Time@Peak Reflow Temperature-Max (s) 30

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