74LVC1G98GW
vs
SN74LVC1G57DCKR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOT-363
|
SOIC
|
Package Description |
PLASTIC, SOT-363, SC-88, PACKAGE-6
|
GREEN, PLASTIC, SC-70, 6 PIN
|
Pin Count |
6
|
6
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
JESD-609 Code |
e3
|
e3
|
Length |
2 mm
|
2 mm
|
Logic IC Type |
LOGIC CIRCUIT
|
MAJORITY LOGIC GATE
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
2.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Tin (Sn)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
1.25 mm
|
1.25 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
Texas Instruments
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.032 A
|
Number of Inputs |
|
1
|
Package Equivalence Code |
|
TSSOP6,.08
|
Packing Method |
|
TR
|
Power Supply Current-Max (ICC) |
|
0.01 mA
|
Propagation Delay (tpd) |
|
16.4 ns
|
Schmitt Trigger |
|
YES
|
|
|
|
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