74LVC244ABX vs TD74ABT244FW feature comparison

74LVC244ABX NXP Semiconductors

Buy Now Datasheet

TD74ABT244FW Toshiba America Electronic Components

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code QFN SOIC
Package Description HVQCCN, SOP,
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z ABT
JESD-30 Code R-PQCC-N20 R-PDSO-G20
JESD-609 Code e4
Length 4.5 mm 12.8 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Equivalence Code LCC20,.1X.18,20 SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 9 ns 4.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 2.7 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 1.2 V 4.5 V
Supply Voltage-Nom (Vsup) 2.7 V 5 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 2.5 mm 7.5 mm
Base Number Matches 2 1
Additional Feature POWER OFF DISABLE OUTPUTS
Load Capacitance (CL) 50 pF
Power Supply Current-Max (ICC) 40 mA

Compare TD74ABT244FW with alternatives