74LVC244ABX
vs
TD74ABT244FW
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TOSHIBA CORP
|
Part Package Code |
QFN
|
SOIC
|
Package Description |
HVQCCN,
|
SOP,
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
ABT
|
JESD-30 Code |
R-PQCC-N20
|
R-PDSO-G20
|
JESD-609 Code |
e4
|
|
Length |
4.5 mm
|
12.8 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
4
|
4
|
Number of Functions |
2
|
2
|
Number of Ports |
2
|
2
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
SOP
|
Package Equivalence Code |
LCC20,.1X.18,20
|
SOP20,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Propagation Delay (tpd) |
9 ns
|
4.6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.5 mm
|
2.7 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.2 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
2.5 mm
|
7.5 mm
|
Base Number Matches |
2
|
1
|
Additional Feature |
|
POWER OFF DISABLE OUTPUTS
|
Load Capacitance (CL) |
|
50 pF
|
Power Supply Current-Max (ICC) |
|
40 mA
|
|
|
|
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