74LVC257ABQ,115 vs 74LVC158PW-T feature comparison

74LVC257ABQ,115 Nexperia

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74LVC158PW-T NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code QFN
Package Description QFN-16 TSSOP,
Pin Count 16
Manufacturer Package Code SOT763-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer Nexperia
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PQCC-N16 R-PDSO-G16
JESD-609 Code e4
Length 3.5 mm 5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR, 7 INCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2.7 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD SILVER
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 2.5 mm 4.4 mm
Base Number Matches 1 1

Compare 74LVC257ABQ,115 with alternatives

Compare 74LVC158PW-T with alternatives