74LVC257ABQ,115
vs
MC74LCX257DT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NEXPERIA
|
ON SEMICONDUCTOR
|
| Part Package Code |
QFN
|
TSSOP
|
| Package Description |
QFN-16
|
TSSOP, TSSOP16,.25
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT763-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Nexperia
|
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PQCC-N16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3.5 mm
|
5 mm
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR, 7 INCH
|
RAIL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
7 ns
|
7.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
2.5 mm
|
4.4 mm
|
| Base Number Matches |
1
|
6
|
| Max I(ol) |
|
0.024 A
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Prop. Delay@Nom-Sup |
|
6 ns
|
|
|
|
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