74LVC273PW,118 vs 74LVC273APG8 feature comparison

74LVC273PW,118 NXP Semiconductors

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74LVC273APG8 Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP2 TSSOP
Package Description 4.4 MM, PLASTIC, SOT360-1, MO-013AC; TSSOP-20 TSSOP, TSSOP20,.25
Pin Count 20 20
Manufacturer Package Code SOT360-1 PG20
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4 e0
Length 6.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 150000000 Hz
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Bits 8
Number of Functions 1 8
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP20,.25 TSSOP20,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 240
Propagation Delay (tpd) 11.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 20
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm
fmax-Min 125 MHz
Base Number Matches 2 1
Pbfree Code No

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Compare 74LVC273APG8 with alternatives