74LVC2G07GW vs 74LVC2G07GV feature comparison

74LVC2G07GW Philips Semiconductors

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74LVC2G07GV NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08 TSOP6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 4.7 ns 4.7 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.95 mm
Terminal Position DUAL DUAL
Base Number Matches 3 3
Pbfree Code Yes
Part Package Code TSOP
Package Description PLASTIC, SC-74, SOT-457, TSOP-6
Pin Count 6
ECCN Code EAR99
Family LVC/LCX/Z
Length 2.9 mm
Number of Functions 2
Number of Inputs 1
Propagation Delay (tpd) 8.4 ns
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Time@Peak Reflow Temperature-Max (s) 30
Width 1.5 mm

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