74LVC2G07GW
vs
74LVC2G07GV-Q100H
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
| JESD-609 Code |
e3
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Max I(ol) |
0.024 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP6,.08
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
4.7 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
NO
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
TSOP
|
| Package Description |
|
TSSOP,
|
| Pin Count |
|
6
|
| Manufacturer Package Code |
|
SOT457
|
| Family |
|
LVC/LCX/Z
|
| Length |
|
2.9 mm
|
| Number of Functions |
|
2
|
| Number of Inputs |
|
1
|
| Propagation Delay (tpd) |
|
8.4 ns
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
1.65 V
|
| Width |
|
1.5 mm
|
|
|
|