74LVC2G14GW,125
vs
NC7SP08L6X
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
TSSOP
|
SON
|
Package Description |
PLASTIC, SOT-363, SC-88, 6 PIN
|
VSON,
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
SOT363
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Family |
LVC/LCX/Z
|
P
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-N6
|
JESD-609 Code |
e3
|
e4
|
Length |
2 mm
|
1.45 mm
|
Logic IC Type |
INVERTER
|
AND GATE
|
Max I(ol) |
0.024 A
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
1
|
Number of Inputs |
1
|
2
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
VSON
|
Package Equivalence Code |
TSSOP6,.08
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
12 ns
|
46.3 ns
|
Qualification Status |
Not Qualified
|
|
Schmitt Trigger |
YES
|
|
Seated Height-Max |
1.1 mm
|
0.55 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
0.9 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Tin (Sn)
|
NICKEL GOLD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.25 mm
|
1 mm
|
Base Number Matches |
2
|
3
|
Pbfree Code |
|
Yes
|
|
|
|
Compare 74LVC2G14GW,125 with alternatives