Findchips: Compare 74LVC2G14GW-Q100 vs 74LVC2G14GW,125

74LVC2G14GW-Q100 vs 74LVC2G14GW,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	SOT-363	TSSOP
Package Description	TSSOP,	PLASTIC, SOT-363, SC-88, 6 PIN
Pin Count	6	6
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G6	R-PDSO-G6
Length	2 mm	2 mm
Logic IC Type	INVERTER	INVERTER
Number of Functions	2	2
Number of Inputs	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	12 ns	12 ns
Screening Level	AEC-Q100
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	1.25 mm	1.25 mm
Base Number Matches	2	2
Rohs Code		Yes
Manufacturer Package Code		SOT363
ECCN Code		EAR99
Samacsys Manufacturer		NXP
JESD-609 Code		e3
Max I(ol)		0.024 A
Moisture Sensitivity Level		1
Package Equivalence Code		TSSOP6,.08
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Qualification Status		Not Qualified
Schmitt Trigger		YES
Terminal Finish		Tin (Sn)
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates