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74LVC2G34GW,125 vs SN74LVC2G34DCK3 feature comparison

74LVC2G34GW,125 NXP Semiconductors

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SN74LVC2G34DCK3 Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code TSSOP
Package Description PLASTIC, SC-88, SOT-363, 6 PIN SC-70, 6 PIN
Pin Count 6
Manufacturer Package Code SOT363
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e6
Length 2 mm 2 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.024 A 0.032 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 5.1 ns
Propagation Delay (tpd) 10.8 ns 8.6 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) Tin/Bismuth (Sn/Bi)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Samacsys Manufacturer Texas Instruments
Power Supply Current-Max (ICC) 0.01 mA
Logic » Gates
Logic » Gates

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