74LVC2G34GW-Q100 vs 74LVC2G34GW/C,125 feature comparison

74LVC2G34GW-Q100 NXP Semiconductors

Buy Now Datasheet

74LVC2G34GW/C,125 Nexperia

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOT-363 TSSOP
Package Description TSSOP, PLASTIC, SOT-363, SC-88, 6 PIN
Pin Count 6 6
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G6
JESD-609 Code e3
Length 2 mm
Logic IC Type BUFFER
Moisture Sensitivity Level 1
Number of Functions 2
Number of Inputs 1
Number of Terminals 6
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 10.8 ns
Screening Level AEC-Q100
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.25 mm
Base Number Matches 2 2
Manufacturer Package Code SOT363

Compare 74LVC2G34GW-Q100 with alternatives