74LVC574APW vs 74LVC574APW feature comparison

74LVC574APW Nexperia

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74LVC574APW NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 1993-08-01
Additional Feature BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4 e4
Length 6.5 mm 6.5 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 15.1 ns 10 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 1.8 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 4.4 mm
Base Number Matches 4 7
Pbfree Code Yes
Part Package Code TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20
Pin Count 20
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 100000000 Hz
Max I(ol) 0.024 A
Package Equivalence Code TSSOP20,.25
Packing Method TUBE
Prop. Delay@Nom-Sup 9 ns
Qualification Status Not Qualified
Trigger Type POSITIVE EDGE

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Compare 74LVC574APW with alternatives