74LVC823APW,112 vs IDT74LVC823AP feature comparison

74LVC823APW,112 Nexperia

Buy Now Datasheet

IDT74LVC823AP Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEXPERIA INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP2 TSSOP
Package Description TSSOP-24 TSSOP,
Pin Count 24 24
Manufacturer Package Code SOT355-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 1996-02-01
Samacsys Manufacturer Nexperia
Additional Feature WITH CLEAR AND CLOCK ENABLE
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e4 e0
Length 7.8 mm 7.8 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 9 9
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 11.5 ns 8.9 ns
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 4.4 mm
Base Number Matches 2 1
Qualification Status Not Qualified

Compare 74LVC823APW,112 with alternatives

Compare IDT74LVC823AP with alternatives