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74LVC841ABQ,115 vs 74LVC827AD,118 feature comparison

74LVC841ABQ,115 NXP Semiconductors

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74LVC827AD,118 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN SOP
Package Description HVQCCN,
Pin Count 24 24
Manufacturer Package Code SOT815-1 SOT137-1
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PQCC-N24 R-PDSO-G24
JESD-609 Code e4 e4
Length 5.5 mm 15.4 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 11 ns 7.1 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 2.65 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.5 mm 7.5 mm
Base Number Matches 1 1
Additional Feature WITH DUAL OUTPUT ENABLE
Load Capacitance (CL) 50 pF
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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