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74LVC841ABQ,115 vs 74LVC841AD-T feature comparison

74LVC841ABQ,115 NXP Semiconductors

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74LVC841AD-T Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code QFN
Package Description HVQCCN,
Pin Count 24
Manufacturer Package Code SOT815-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z
JESD-30 Code R-PQCC-N24 R-PDSO-G24
JESD-609 Code e4
Length 5.5 mm
Logic IC Type BUS DRIVER D LATCH
Moisture Sensitivity Level 1 1
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 2
Number of Terminals 24 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.5 mm
Base Number Matches 1 2
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code SOP24,.4
Packing Method TR
Prop. Delay@Nom-Sup 6.7 ns
Logic » Bus Driver/Transceivers
Logic » FF/Latches

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