74LVC86AD,118 vs TC74LCX86FN feature comparison

74LVC86AD,118 NXP Semiconductors

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TC74LCX86FN Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description PLASTIC, SO-14 SOP, SOP14,.25
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type XOR GATE XOR GATE
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 6 ns 6.5 ns
Propagation Delay (tpd) 5.8 ns 7 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2 V
Supply Voltage-Nom (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Additional Feature NOT AVAILABLE IN JAPAN

Compare 74LVC86AD,118 with alternatives

Compare TC74LCX86FN with alternatives