74LVCH162374ADL-T
vs
74LVCH162374ADGG,1
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
TSSOP, TSSOP48,.3,20
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Date Of Intro |
2017-02-01
|
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
TSSOP
|
Pin Count |
|
48
|
Manufacturer Package Code |
|
SOT362-1
|
Family |
|
LVC/LCX/Z
|
JESD-30 Code |
|
R-PDSO-G48
|
Length |
|
12.5 mm
|
Load Capacitance (CL) |
|
50 pF
|
Max Frequency@Nom-Sup |
|
120000000 Hz
|
Max I(ol) |
|
0.012 A
|
Number of Bits |
|
8
|
Number of Functions |
|
2
|
Number of Ports |
|
2
|
Number of Terminals |
|
48
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
|
3-STATE WITH SERIES RESISTOR
|
Output Polarity |
|
TRUE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TSSOP
|
Package Equivalence Code |
|
TSSOP48,.3,20
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
|
BULK PACK
|
Power Supplies |
|
3.3 V
|
Prop. Delay@Nom-Sup |
|
8.5 ns
|
Propagation Delay (tpd) |
|
10 ns
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
1.2 V
|
Supply Voltage-Nom (Vsup) |
|
2.7 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
DUAL
|
Trigger Type |
|
POSITIVE EDGE
|
Width |
|
6.1 mm
|
|
|
|
Compare 74LVCH162374ADL-T with alternatives
Compare 74LVCH162374ADGG,1 with alternatives