74LVCH16245AEVY
vs
935281128518
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
| Part Package Code |
BGA
|
|
| Package Description |
4.50 X 7 MM, 0.65 MM PITCH, PLASTIC, MO-225, SOT702-1, VFBGA-56
|
VFBGA,
|
| Pin Count |
56
|
|
| Manufacturer Package Code |
SOT702-1
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Factory Lead Time |
4 Weeks
|
|
| Additional Feature |
WITH DIRECTION CONTROL
|
WITH DIRECTION CONTROL
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PBGA-B56
|
R-PBGA-B56
|
| JESD-609 Code |
e0
|
e1
|
| Length |
7 mm
|
7 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Propagation Delay (tpd) |
6 ns
|
13.8 ns
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
1.2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
4.5 mm
|
4.5 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| HTS Code |
|
8542.39.00.01
|
| Moisture Sensitivity Level |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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