74LVT16245BBX,518 vs 74LVT16245BBX feature comparison

74LVT16245BBX,518 NXP Semiconductors

Buy Now Datasheet

74LVT16245BBX NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 4 X 6 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT1134-1, HXQFN-60 HVBCC,
Pin Count QFN 60
Manufacturer Package Code SOT1134-2
Reach Compliance Code compliant compliant
Factory Lead Time 4 Weeks
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Family LVT LVT
JESD-30 Code R-PBCC-B60 R-PBCC-B60
Length 6 mm 6 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.064 A
Moisture Sensitivity Level 2 2
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 60 60
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVBCC HVBCC
Package Equivalence Code LGA60,8X12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 3.3 ns
Propagation Delay (tpd) 3.5 ns 3.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BUTT BUTT
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4 mm 4 mm
Base Number Matches 2 2
Part Package Code QFN
HTS Code 8542.39.00.01

Compare 74LVT16245BBX with alternatives