74LVX4245MTCX
vs
MC74LVX4245DT
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ON SEMICONDUCTOR
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
TSSOP,
|
TSSOP, TSSOP24,.25
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
4.5V TO 5.5V SUPPLY FOR PORT A; 2.7V TO 3.6V SUPPLY FOR PORT B
|
3.3V SUPPLY FOR PORT A; 5V SUPPLY FOR PORT B
|
| Family |
LV/LV-A/LVX/H
|
LV/LV-A/LVX/H
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| Length |
7.8 mm
|
7.8 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
9 ns
|
10 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
1
|
4
|
| Rohs Code |
|
Yes
|
| Control Type |
|
COMMON CONTROL
|
| Count Direction |
|
BIDIRECTIONAL
|
| JESD-609 Code |
|
e4
|
| Max I(ol) |
|
0.024 A
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
TSSOP24,.25
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
9 ns
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare 74LVX4245MTCX with alternatives
Compare MC74LVX4245DT with alternatives