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74SSTUB32865AZJBR vs SSTUA32S865ET,557 feature comparison

74SSTUB32865AZJBR Texas Instruments

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SSTUA32S865ET,557 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description PLASTIC, TFBGA-160 TFBGA, BGA160,12X18,25
Pin Count 160 160
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family SSTU SSTU
JESD-30 Code R-PBGA-B160 R-PBGA-B160
JESD-609 Code e1 e0
Length 13 mm 13 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 410000000 Hz
Max I(ol) 0.012 A
Moisture Sensitivity Level 3
Number of Bits 28 28
Number of Functions 1 1
Number of Terminals 160 160
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA160,12X18,25 BGA160,12X18,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 1.1 ns
Propagation Delay (tpd) 3 ns 1.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.9 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 9 mm 9 mm
fmax-Min 410 MHz 450 MHz
Base Number Matches 1 1
Manufacturer Package Code SOT802-2
Logic » FF/Latches
Logic » FF/Latches

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