74SSTUB32865AZJBR vs SSTUP32866EC/G feature comparison

74SSTUB32865AZJBR Texas Instruments

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SSTUP32866EC/G NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description PLASTIC, TFBGA-160 LFBGA, BGA96,6X16,32
Pin Count 160 96
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family SSTU 32866
JESD-30 Code R-PBGA-B160 R-PBGA-B96
JESD-609 Code e1
Length 13 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 410000000 Hz
Max I(ol) 0.012 A
Moisture Sensitivity Level 3 2
Number of Bits 28 25
Number of Functions 1 1
Number of Terminals 160 96
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA160,12X18,25 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 1.1 ns
Propagation Delay (tpd) 3 ns 1.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 9 mm 5.5 mm
fmax-Min 410 MHz 450 MHz
Base Number Matches 1 2
Manufacturer Package Code SOT-536-1

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