Findchips: Compare 74VHC27CW vs 74LVC38ABQ,115

74VHC27CW vs 74LVC38ABQ,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	FAIRCHILD SEMICONDUCTOR CORP	NXP SEMICONDUCTORS
Package Description	DIE,	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	AHC/VHC	LVC/LCX/Z
JESD-30 Code	R-XUUC-N14	R-PQCC-N14
Logic IC Type	NOR GATE	NAND GATE
Number of Functions	3	4
Number of Inputs	3	2
Number of Terminals	14	14
Package Body Material	UNSPECIFIED	PLASTIC/EPOXY
Package Code	DIE	HVQCCN
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	UNCASED CHIP	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd)	12.3 ns	5 ns
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	5.5 V	3.6 V
Supply Voltage-Min (Vsup)	2 V	1.2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Form	NO LEAD	NO LEAD
Terminal Position	UPPER	QUAD
Base Number Matches	1	1
Rohs Code		Yes
Part Package Code		QFN
Pin Count		14
Manufacturer Package Code		SOT762-1
JESD-609 Code		e4
Length		3 mm
Max I(ol)		0.024 A
Moisture Sensitivity Level		1
Operating Temperature-Max		125 °C
Operating Temperature-Min		-40 °C
Output Characteristics		OPEN-DRAIN
Package Equivalence Code		LCC14,.1X.12,20
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		4.5 ns
Schmitt Trigger		NO
Seated Height-Max		1 mm
Supply Voltage-Nom (Vsup)		2.7 V
Temperature Grade		AUTOMOTIVE
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		0.5 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		2.5 mm
	Logic » Gates	Logic » Gates