74VHC32FT
vs
74AHC32D,118
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NEXPERIA
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
TSSOP,
|
3.90 MM, PLASTIC, MS-012, SOT-108-1, SO-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
24 Weeks
|
6 Weeks
|
| Samacsys Manufacturer |
Toshiba
|
Nexperia
|
| Family |
AHC/VHC/H/U/V
|
AHC
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
5 mm
|
8.65 mm
|
| Logic IC Type |
OR GATE
|
OR GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
13 ns
|
14.5 ns
|
| Seated Height-Max |
1.2 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
3.9 mm
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
SOT108-1
|
| Date Of Intro |
|
1998-12-10
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR, 13 INCH
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare 74VHC32FT with alternatives
Compare 74AHC32D,118 with alternatives