7703401TX vs LM117HMW8 feature comparison

7703401TX Microsemi Corporation

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LM117HMW8 National Semiconductor Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code TO-257
Package Description , DIE, WAFER
Pin Count 3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XSFM-P3 X-XUUC-N
Number of Functions 1 1
Number of Terminals 3
Operating Temperature TJ-Max 150 °C 150 °C
Operating Temperature TJ-Min -55 °C -55 °C
Output Voltage1-Max 1.3 V 37 V
Output Voltage1-Min 1.2 V 1.2 V
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR UNSPECIFIED
Package Style FLANGE MOUNT UNCASED CHIP
Qualification Status Qualified Not Qualified
Regulator Type ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
Screening Level MIL-STD-883 38535Q/M;38534H;883B
Surface Mount NO YES
Terminal Form PIN/PEG NO LEAD
Terminal Position SINGLE UPPER
Base Number Matches 7 2
Rohs Code Yes
Adjustability ADJUSTABLE
Dropout Voltage1-Nom 3 V
Line Regulation-Max (%/V) 0.05
Load Regulation-Max(%) 1%
Moisture Sensitivity Level 1
Number of Outputs 1
Output Current1-Max 1.5 A
Package Code DIE
Package Equivalence Code WAFER
Peak Reflow Temperature (Cel) 260
Technology BIPOLAR
Time@Peak Reflow Temperature-Max (s) 40

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