7SB384BMX1TCG
vs
PI5C3301CX
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
PERICOM SEMICONDUCTOR CORP
|
| Part Package Code |
LGA
|
TSSOT
|
| Package Description |
1.20 X 1 MM, 0.40 MM PITCH, LEAD FREE, ULLGA-6
|
TSSOP, TSSOP5/6,.08
|
| Pin Count |
6
|
5
|
| Manufacturer Package Code |
613AE
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
| JESD-30 Code |
R-PBGA-B6
|
R-PDSO-G5
|
| JESD-609 Code |
e4
|
e0
|
| Length |
1.2 mm
|
2 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
6
|
5
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFLGA
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.4 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
BUTT
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
1 mm
|
1.25 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
TSSOP5/6,.08
|
| Technology |
|
CMOS
|
|
|
|
Compare 7SB384BMX1TCG with alternatives
Compare PI5C3301CX with alternatives