7SB384BMX1TCG
vs
PI5C3301TX
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
PERICOM SEMICONDUCTOR CORP
|
Part Package Code |
LGA
|
SOT-23
|
Package Description |
1.20 X 1 MM, 0.40 MM PITCH, LEAD FREE, ULLGA-6
|
PLASTIC, SOT-23, 5 PIN
|
Pin Count |
6
|
5
|
Manufacturer Package Code |
613AE
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
JESD-30 Code |
R-PBGA-B6
|
R-PDSO-G5
|
JESD-609 Code |
e4
|
e0
|
Length |
1.2 mm
|
2.9 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
6
|
5
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
INVERTED
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFLGA
|
LSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.4 mm
|
1.45 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
BUTT
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.95 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Width |
1 mm
|
1.625 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
TSOP5/6,.11,37
|
Technology |
|
CMOS
|
|
|
|
Compare 7SB384BMX1TCG with alternatives
Compare PI5C3301TX with alternatives