8001301ZA
vs
8001301ZX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FILM MICROELECTRONICS INC
|
MS KENNEDY CORP
|
| Part Package Code |
BCY
|
BCY
|
| Package Description |
QIP, QUAD12,.4SQ
|
,
|
| Pin Count |
12
|
12
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.05 µA
|
0.0001 µA
|
| Bias Current-Max (IIB) @25C |
0.0001 µA
|
|
| Common-mode Reject Ratio-Nom |
50 dB
|
50 dB
|
| Frequency Compensation |
NO
|
|
| Input Offset Voltage-Max |
10000 µV
|
5000 µV
|
| JESD-30 Code |
O-MBCY-W12
|
O-MBCY-P12
|
| JESD-609 Code |
e0
|
|
| Low-Offset |
NO
|
|
| Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
12
|
12
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
METAL
|
METAL
|
| Package Code |
QIP
|
|
| Package Equivalence Code |
QUAD12,.4SQ
|
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Slew Rate-Min |
350 V/us
|
|
| Slew Rate-Nom |
500 V/us
|
|
| Supply Current-Max |
20 mA
|
|
| Supply Voltage Limit-Max |
18 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - hot dipped
|
|
| Terminal Form |
WIRE
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Voltage Gain-Min |
710
|
|
| Wideband |
YES
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 8001301ZA with alternatives
Compare 8001301ZX with alternatives