83021AMILFT
vs
MC10ELT21DTR2G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
ONSEMI
|
| Part Package Code |
SOIC
|
SOIC
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
DCG8
|
948R-02
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
NLR
|
EAR99
|
| HTS Code |
8542390001
|
8542.39.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Interface IC Type |
LVPECL TO LVTTL TRANSLATOR
|
PECL TO TTL TRANSLATOR
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
3
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Terminal Finish |
TIN
|
TIN
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
LEAD FREE, PLASTIC, TSSOP-8
|
| Factory Lead Time |
|
4 Weeks
|
| Delay-Max |
|
5.5 ns
|
| JESD-30 Code |
|
S-PDSO-G8
|
| Length |
|
3 mm
|
| Number of Bits |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Latch or Register |
|
NONE
|
| Output Polarity |
|
TRUE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max |
|
5.25 V
|
| Supply Voltage-Min |
|
4.75 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
ECL
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3 mm
|
|
|
|
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