83023AMILFT
vs
ICS83023AMI
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
DCG8
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
NLR
|
|
| HTS Code |
8542390001
|
8542.39.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| JESD-609 Code |
e3
|
e0
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Base Number Matches |
2
|
3
|
| Package Description |
|
3.80 X 4.80 MM, 1.47 MM HEIGHT, MS-012, SOIC-8
|
| Family |
|
83023
|
| Input Conditioning |
|
DIFFERENTIAL
|
| JESD-30 Code |
|
R-PDSO-G8
|
| Length |
|
4.9 mm
|
| Number of Functions |
|
2
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
|
8
|
| Number of True Outputs |
|
1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP8,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Prop. Delay@Nom-Sup |
|
2.4 ns
|
| Propagation Delay (tpd) |
|
2.4 ns
|
| Qualification Status |
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
|
0.06 ns
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
3.9 mm
|
|
|
|
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