Findchips: Compare 8403701CA vs GD74HC00J

8403701CA vs GD74HC00J feature comparison

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Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	MOTOROLA INC	LG SEMICON CO LTD
Package Description	,	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	S-CQCC-N20	R-XDIP-T14
Length	8.89 mm	19.939 mm
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	20	14
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC
Package Code	QCCN	DIP
Package Shape	SQUARE	RECTANGULAR
Package Style	CHIP CARRIER	IN-LINE
Peak Reflow Temperature (Cel)	NOT APPLICABLE
Propagation Delay (tpd)	135 ns	115 ns
Seated Height-Max	2.03 mm	4.572 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	INDUSTRIAL
Terminal Form	NO LEAD	THROUGH-HOLE
Terminal Pitch	1.27 mm	2.54 mm
Terminal Position	QUAD	DUAL
Time@Peak Reflow Temperature-Max (s)	NOT APPLICABLE
Width	8.89 mm	7.62 mm
Base Number Matches	5	2
Rohs Code		No
JESD-609 Code		e0
Max I(ol)		0.004 A
Package Equivalence Code		DIP14,.3
Prop. Delay@Nom-Sup		23 ns
Qualification Status		Not Qualified
Schmitt Trigger		NO
Terminal Finish		Tin/Lead (Sn/Pb)
	Logic » Gates	Logic » Gates