8403701CA
vs
HD74HC00RPEL
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
RENESAS ELECTRONICS CORP
|
| Package Description |
,
|
SOP, SOP14,.25
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
HC/UH
|
| Length |
8.89 mm
|
8.65 mm
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Moisture Sensitivity Level |
NOT APPLICABLE
|
1
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
20
|
14
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
260
|
| Propagation Delay (tpd) |
135 ns
|
115 ns
|
| Seated Height-Max |
2.03 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
20
|
| Width |
8.89 mm
|
3.95 mm
|
| Base Number Matches |
5
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| JESD-30 Code |
|
R-PDSO-G14
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.004 A
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP14,.25
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
23 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
NO
|
| Surface Mount |
|
YES
|
| Terminal Form |
|
GULL WING
|
|
|
|
Compare 8403701CA with alternatives
Compare HD74HC00RPEL with alternatives