8403701CA
vs
MC54HC00AJD
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HC/UH
JESD-30 Code
S-CQCC-N20
R-XDIP-T14
Length
8.89 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
Number of Inputs
2
Number of Terminals
20
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
QCCN
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Propagation Delay (tpd)
135 ns
Seated Height-Max
2.03 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
8.89 mm
Base Number Matches
5
3
Rohs Code
JESD-609 Code
e0
Max I(ol)
0.004 A
Package Equivalence Code
DIP14,.3
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
22 ns
Schmitt Trigger
NO
Terminal Finish
Tin/Lead (Sn/Pb)
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