Findchips: Compare 8403701CX vs 74HC00D,653

8403701CX vs 74HC00D,653 feature comparison

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Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	MOTOROLA INC	NEXPERIA
Package Description	DIP,	SOP-14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-GDIP-T14	R-PDSO-G14
Length	19.56 mm	8.65 mm
Logic IC Type	NAND GATE	NAND GATE
Moisture Sensitivity Level	NOT APPLICABLE	1
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Cel)	NOT APPLICABLE	260
Propagation Delay (tpd)	135 ns	135 ns
Qualification Status	Not Qualified
Seated Height-Max	5.08 mm	1.75 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	1.27 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	NOT APPLICABLE	30
Width	7.62 mm	3.9 mm
Base Number Matches	5	2
Rohs Code		Yes
Part Package Code		SOIC
Pin Count		14
Manufacturer Package Code		SOT108-1
ECCN Code		EAR99
Factory Lead Time		6 Weeks
Date Of Intro		1993-11-01
Samacsys Manufacturer		Nexperia
JESD-609 Code		e4
Packing Method		TR, 13 INCH
Terminal Finish		NICKEL PALLADIUM GOLD
	Logic » Gates	Logic » Gates