8403701CX vs 74HC00D/T3 feature comparison

8403701CX Intersil Corporation

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74HC00D/T3 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, 3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Length 19.56 mm 8.65 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level NOT APPLICABLE 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT APPLICABLE NOT SPECIFIED
Propagation Delay (tpd) 135 ns 135 ns
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE NOT SPECIFIED
Width 7.62 mm 3.9 mm
Base Number Matches 5 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Qualification Status Not Qualified
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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Compare 74HC00D/T3 with alternatives