8403701CX vs CD74HCT00M feature comparison

8403701CX Intersil Corporation

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CD74HCT00M General Electric Solid State

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR GENERAL ELECTRIC SOLID STATE
Part Package Code DIP
Package Description DIP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Length 19.56 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level NOT APPLICABLE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Propagation Delay (tpd) 135 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm
Base Number Matches 5 7
Rohs Code No
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Prop. Delay@Nom-Sup 30 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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